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datasheet product structure silicon monolithic integrated circuit this product is not designed protection against rad ioactive rays 1/26 tsz22111 ? 14 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 www.rohm.com 1 channel compact high side switch ics 1ch adjustable current limit high side switch ics bd2222g bd2242g bd2243g description bd2222g, bd2242g and bd2243g are low on-resistance n-channel mosfet high-side power switches, optimized for universal serial bus (usb) applications. these devices are equipped with the function of over-current detection, thermal shutdow n, under-voltage lockout and soft-start. moreover, the range of current limit threshold can be adjusted fr om 0.2a to 1.7a by changing the external resistance. features adjustable current limit threshold: 200ma to 1.7a low on-resistance (typ 89m ? ) n-channel mosfet built-in soft-start circuit output discharge function bd2242g, bd2243g open-drain fault flag output thermal shutdown under-voltage lockout reverse current protection when power switch off control input logic active-high active-high: bd2222g, bd2242g active-low: bd2243g applications usb hub in consumer appliances, pc, pc peripheral equipment and so forth key specifications input voltage range: 2.8v to 5.5v on resistance: (in=5v) 89m ? (typ) current limit threshold: 0.2a to 1.7a adjustable standby current: 0.01 a (typ) operating temperature range: -40c to +85c package w(typ) d(typ) h (max) ssop6 2.90mm x 2.80mm x 1.25mm typical application circuit c l 120 f c in 1 f in gnd en out /oc 5v (typ) + - r lim ilim 3.3v 10k to 100k 10 f lineup output load current adjustable current limit threshold channel control input logic output discharge function package orderable part number max 1.5a 200ma to 1.7a 1ch high no ssop6 reel of 3000 bd2222g C gtr 1.5a 200ma to 1.7a 1ch high yes ssop6 reel of 3000 bd2242g C gtr 1.5a 200ma to 1.7a 1ch low yes ssop6 reel of 3000 bd2243g C gtr ssop6 figure 1. typical application circuit downloaded from: http:///
2/26 d a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 over-current protection delay counter charge pump thermal shutdown en in /oc gnd out reverse current protection ilim under-voltage lockout block diagram pin configuration out gnd en ilim /oc in 1 2 3 4 5 6 pin descriptions pin no. symbol i/o function 1 in i switch input and the supply voltage for the i c. 2 gnd - ground. 3 en i enable input. high-level input turns on the switch (bd2222g, bd2242 g) low-level input turns on the switch (bd2243g) 4 /oc o over-current notification terminal. low level output during over-current or over-temper ature condition. open-drain fault flag output. 5 ilim o current limit threshold set pin. external resistor u sed to set current limit threshold. recommended 11.97 k ? r lim 106.3 k ? 6 out o power switch output. figure 4. pin configuration (top view) over-current protection under-voltage lockout delay counter charge pump thermal shutdown en in /oc gnd out /en reverse current protection ilim figure 2. block diagram (bd2222g) figure 3. block diagram (bd2242g, bd2243g) downloaded from: http:///
3/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 absolute maximum ratings (ta=25c) parameter symbol rating unit in supply voltage v in -0.3 to +7.0 v en input voltage v en -0.3 to +7.0 v ilim voltage v ilim -0.3 to +7.0 v ilim source current i ilim 1 ma /oc voltage v /oc -0.3 to +7.0 v /oc sink current i /oc 10 ma out voltage v out -0.3 to +7.0 v storage temperature tstg -55 to +150 c power dissipation (note1) pd 0.67 w (note 1) mounted on 70mm x 70mm x 1.6mm glass epoxy bo ard. reduce 5.4mw per 1 above 25 caution: operating the ic over the absolute maximum ratings ma y damage the ic. in addition, it is impossible to predict all destructive situations such as short-circuit mod es, open circuit modes, etc. therefore, it is importan t to consider circuit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings. recommended operating conditions parameter symbol rating unit min typ max in operating voltage v in 2.8 5.0 5.5 v operating temperature t opr -40 - +85 c electrical characteristics (v in = 5v, r lim =20k ? , ta = 25c, unless otherwise specified.) dc characteristics parameter symbol limit unit conditions min typ max operating current i dd - 120 168 a v en = 5v, v out = open, (bd2222g, bd2242g) v en = 0v, v out = open, (bd2243g) standby current i stb - 0.01 5 a v en = 0v, v out = open, (bd2222g, bd2242g) v en = 5v, v out = open, (bd2243g) en input voltage v enh 2.0 - - v high input v enl - - 0.8 v low input en input leakage i en -1 0.01 1 a v en = 0v or 5v on-resistance r on - 89 120 m ? i out = 500ma reverse leak current i rev - - 1 a v out = 5v, v in = 0v current limit threshold i th 112 212 313 ma r lim = 100k ? 911 1028 1145 r lim = 20k ? 1566 1696 1826 r lim = 12k ? output discharge resistance r disc 30 60 120 ? i out = -1ma, v en = 0v (bd2242g) i out = -1ma, v en = 5v (bd2243g) /oc output low voltage v /oc - - 0.4 v i /oc = -1ma uvlo threshold v tuvh 2.35 2.55 2.75 v v in increasing v tuvl 2.30 2.50 2.70 v v in decreasing downloaded from: http:///
4/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 ac characteristics parameter symbol limits unit conditions min typ max output rise time t on1 - 0.6 6 ms r l = 100 ? output turn-on time t on 2 - 1 10 ms output fall time t off1 - 1.8 20 s output turn-off time t off2 - 3.2 40 s /oc delay time t /oc 4 7 12 ms measurement circuit in gnd en out /oc v in v en a 1f ilim r lim c in = i in in gnd en out /oc v in v en 1f r l ilim r lim c in = a. operating current, standby current b. en input vol tage, output rise/fall time output turn-on/ turn-off time in en out /oc v in v en 1f a i in 10k ? ilim r lim gnd 100f i out c l = c in = 100f in en out /oc v in v en 1f 1ma ilim r lim gnd 100f i out c l = c in = i /oc = c. on-resistance, current limit threshold, /oc del ay time use capacitance more than 100 f at output short circuit test by using external power supply. d. /oc output low voltage in gnd en out /oc v in v en 1f r l ilim r lim c in = in gnd en out /oc v in v en 1f ilim r lim c in = 1ma i out = e. uvlo threshold f. output discharge resistance figure 5. measurement circuit downloaded from: http:///
5/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 timing diagram t on1 t off1 90% 10% 10% t on2 t off2 v enh v enl 90% v en v out t on1 t off1 90% 10% 10% t on2 t off2 v enl v enh 90% v en v out figure 6. output rise/fall time (bd2222g, bd2242g) figure 7. output rise/fall time (bd2243g) downloaded from: http:///
6/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 typical performance curves 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[c] standby current : i stb [ a] 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 supply voltage : v in [v] standby current : i stb [ a] 0 40 80 120 160 -50 0 50 100 ambient temperature : ta[c] operationg current : i dd [ a] 0 40 80 120 160 2 3 4 5 6 supply voltage : v in [v] operating current : i dd [ a] ta=25 c r lim =20k ? figure 8. operating current vs supply voltage en enable v in =5.0v r lim =20k ? figure 9. operating current vs ambient temperature en enable ta=25 c r lim =20k ? figure 10. standby current vs supply voltage en disable v in =5.0v r lim =20k ? figure 11. standby current vs ambient temperature en disable downloaded from: http:///
7/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 typical performance curves - continued 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[c] on resistance : r on [m ] 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] on resistance : r on [m ] 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[c] enable input voltage : v en [v] 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v in [v] enable input voltage : v en [v] ta=25 c r lim =20k ? low to high high to low figure 12. en input voltage vs supply voltage v in =5.0v r lim =20k ? low to high high to low figure 13. en input voltage vs ambient temperature ta=25 c r lim =20k ? i out =500ma figure 14. on-resistance vs supply voltage v in =5.0v r lim =20k ? i out =500ma figure 15. on-resistance vs ambient temperature downloaded from: http:///
8/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 typical performance curves - continued 0.0 0.1 0.2 0.3 0.4 0.5 -50 0 50 100 ambient temperature : ta[c] over current threshold : i th [a] 0.8 0.9 1.0 1.1 1.2 1.3 2 3 4 5 6 supply voltage : v in [v] over current threshold : i th [a] 0.8 0.9 1.0 1.1 1.2 1.3 -50 0 50 100 ambient temperature : ta[c] over current threshold : i th [a] 0.0 0.1 0.2 0.3 0.4 0.5 2 3 4 5 6 supply voltage : v in [v] over current threshold : i th [a] v in =5.0v r lim =100k ? figure 17. over-current threshold 1 vs ambient temperature ta=25 c r lim =20k ? figure 18. over-current threshold 2 vs supply voltage v in =5.0v r lim =20k ? figure 19. over-current threshold 2 vs ambient temperature ta=25 c r lim =100k ? figure 16. over-current threshold 1 vs supply voltage downloaded from: http:///
9/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 typical performance curves - continued 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[c] /oc output low voltage : v /oc [mv] 0 20 40 60 80 100 2 3 4 5 6 supply voltage : v in [v] /oc output low voltage : v /oc [mv] 1.5 1.6 1.7 1.8 1.9 2.0 -50 0 50 100 ambient temperature : ta[c] over current threshold : i th [a] 1.5 1.6 1.7 1.8 1.9 2.0 2 3 4 5 6 supply voltage : v in [v] over current threshold : i th [a] v in =5.0v r lim =12k ? figure 21. over-current threshold 3 vs ambient temperature ta=25 c r lim =20k ? i /oc =1ma figure 22. /oc output low voltage vs supply voltage v in =5.0v r lim =20k ? i /oc =1ma figure 23. /oc output low voltage vs ambient temperature ta=25 c r lim =12k ? figure 20. over-current threshold 3 vs supply voltage downloaded from: http:///
10/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 typical performance curves - continued 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 ambient temperature : ta[c] output rise time : t on1 [ms] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 2 3 4 5 6 supply voltage : v in [v] output rise time : t on1 [ms] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[c] uvlo hysteresis voltage:v hsy [v] 2.2 2.3 2.4 2.5 2.6 2.7 -50 0 50 100 ambient temperature : ta[ ] uvlo threshold : v tuvh , v tuvl [v] v in =5.0v r lim =20k ? r l =100 ? figure 27. output rise time vs ambient temperature r lim =20k ? v tuvh v tuvl figure 24. uvlo threshold vs ambient temperature r lim =20k ? figure 25. uvlo hysteresis voltage vs ambient temperature ta=25 c r lim =20k ? r l =100 ? figure 26. output rise time vs supply voltage downloaded from: http:///
11/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 typical performance curves - continued 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[c] output fall time : t off1 [ s] 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] output fall time : t off1 [ s] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 ambient temperature : ta[c] output turn on time : t on2 [ms] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 2 3 4 5 6 supply voltage : v in [v] output turn on time : t on2 [ms] ta=25 c r lim =20k ? r l =100 ? figure 28. output turn-on time vs supply voltage v in =5.0v r lim =20k ? r l =100 ? figure 29. output turn-on time vs ambient temperature ta=25 c r lim =20k ? r l =100 ? figure 30. output fall time vs supply voltage v in =5.0v r lim =20k ? r l =100 ? figure 31. output fall time vs ambient temperature downloaded from: http:///
12/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 typical performance curves - continued 0 2 4 6 8 10 -50 0 50 100 ambient temperature : ta[c] /oc delay time : t /oc [ms] 0 2 4 6 8 10 2 3 4 5 6 supply voltage : v in [v] /oc delay time : t /oc [ms] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 0 50 100 ambient temperature : ta[c] output turn off time : t off2 [ s] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2 3 4 5 6 supply voltage : v in [v] output turn off time : t off2 [ s] ta=25 c r lim =20k ? r l =100 ? figure 32. output turn-off time vs supply voltage v in =5.0v r lim =20k ? r l =100 ? figure 33. output turn-off time vs ambient temperature ta=25 c r lim =20k ? figure 34. /oc delay time vs supply voltage v in =5.0v r lim =20k ? figure 35. /oc delay time vs ambient temperature downloaded from: http:///
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a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 typical performance curves - continued 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[c] disc on resistance : r disc [ ? ] 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] dsic on resistance : r disc [ ] ta=25 c r lim =20k ? i out =1ma figure 36. discharge on resistance vs supply voltage v in =5.0v r lim =20k ? i out =1ma figure 37. discharge on resistance vs ambient temperature downloaded from: http:///
14/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 typical wave forms time (20ms/div.) figure 41. over current response ramped load time (1ms/div.) figure 40. inrush current response (bd2242g) time (0.5ms/div.) figure 38. output rise characteristic (bd2242g) time (1 s/div.) figure 39. output fall characteristic (bd2242g) c l =47 f c l =100 f v /oc (5v/div.) v out (5v/div.) i in (50ma/div.) v in =5v r lim =20k ? r l =100 ? v in =5v r lim =20k ? r l =100 ? v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i in (50ma/div.) v en (5v/div.) v in =5v r lim =20k ? r l =100 ? c l =220 f c l =47 f c l =100 f v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) v in =5v r lim =20k ? c l =100 f current limit threshold limit current downloaded from: http:///
15/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 typical wave forms - continued time (20ms/div.) figure 42. over current response enable into short circuit (bd2242g) time (20ms/div.) figure 43. over current response disenable from short circuit (bd2242g) v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) v en (5v/div.) v in =5v r lim =20k c l =100 f v in =5v r lim =20k ? c l =100 f tsd detection tsd recovery tsd detection tsd recovery removal of load time (1s/div.) figure 45. uvlo response decreasing v in (bd2242g) v /oc (5v/div.) v out (5v/div.) i in (50ma/div.) v in (5v/div.) v /oc =3.3v r lim =20k ? r l =100 ? v in =v en uvlo detection time (1s/div.) figure 44. uvlo response increasing v in (bd2242g) v /oc (5v/div.) v out (5v/div.) i in (50ma/div.) v in (5v/div.) v /oc =3.3v r lim =20k ? r l =100 ? v in =v en uvlo recovery downloaded from: http:///
16/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 typical wave forms - continued time (2ms/div.) figure 46. over current response 1 ? load connected at enable v out (5v/div.) i in (1a/div.) v /oc (5v/div.) v in =5v r lim =20k ? c l =100 f v out (5v/div.) i in (1a/div.) v /oc (5v/div.) v out (5v/div.) i in (1a/div.) v /oc (5v/div.) v out (5v/div.) i in (1a/div.) v /oc (5v/div.) time (5 s/div.) figure 47. over current response 1 ? load connected at enable time (5 s/div.) figure 49. over current response 0 ? load connected at enable time (2ms/div.) figure 48. over current response 0 ? load connected at enable v in =5v r lim =20k ? c l =100 f v in =5v r lim =20k ? c l =100 f v in =5v r lim =20k ? c l =100 f downloaded from: http:///
17/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 application circuit example controller 10k ? to 100k ? c l c in in gnd en out /oc 5v (typ) + - r lim ilim figure 50. application circuit example application information ringing may cause bad influences on ic operations. in order to avoid this case, connect a bypass capac itor across in terminal and gnd terminal of ic. 1 f or higher is recommended. when excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power source line to ic may exert a bad influence upon ic. in order to decrease voltage fluctuations from power source lin e to ic, connect a low esr capacitor in parallel with c in. 10 f to 100 f or higher is effective. pull up /oc output via resistance value of 10k ? to 100k ? . set up a value for c l which satisfies the application. this system connection diagram does not guarantee o peration as the intended application. when using the circuit with changes to the external circuit values, make sure to leave an adequate mar gin for external components including static and transitional charac teristics as well as the design tolerance of the ic . functional description 1. switch operation in terminal and out terminal are connected to the d rain and the source of switch mosfet respectively. t he in terminal is also used as power source input to internal cont rol circuit. when the switch is turned on from en control input, the in terminal and out terminal are connected by a 89m ? (typ) switch. in on status, the switch is bidirectional. therefore, when the potential of out terminal is hi gher than that of the in terminal, current flows from out terminal to in ter minal. since a parasitic diode between the drain and the so urce of switch mosfet is canceled, current flow from out to in is prevented during off state. 2. thermal shutdown circuit (tsd) if over-current would continue, the temperature of the ic would increase drastically. if the junction temperature were beyond 120 (typ) in the condition of over-current detection, t hermal shutdown circuit operates and makes power sw itch turn off and outputs fault flag (/oc). then, when t he junction temperature decreases lower than 110 (typ), power switch is turned on and fault flag (/oc) is cancelled. als o, regardless of over-current condition, if the jun ction temperature were beyond 160 (typ), thermal shutdown circuit makes power switch turn off and outputs fault flag (/oc).when junction temperature decreases lower than 140 (typ), power switch is turned on and fault flag (/o c) is cancelled. unless the fact of the increasing chips temperature is removed or t he output of power switch is turned off, this opera tion repeats. fault flag (/oc) is output without delay time at thermal shutdown. the thermal shutdown circuit operates when the swit ch is on (en signal is active). 3. over-current detection (ocd) the over current detection circuit (ocd) limits cur rent and outputs error flag (/oc) when current flow ing in each switch mosfet exceeds a specified value. there are three cas es when the ocd is activated. the ocd operates when the switch is on (en signal is active). (1). when the switch is turned on while the output is in short-circuit status, the switch gets in curr ent limit status immediately. (see figure 42) (2). when the output short-circuits or when high cu rrent load is connected while the switch is on, ver y large current flows until the over current limit circuit reacts. when this happens, the over-current limit circuit i s activated and the current limitation is carried out. (see figure 48) downloaded from: http:///
18/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 (3). when the output current increases gradually, c urrent limitation does not work until the output cu rrent exceeds the over current detection value. when it exceeds the d etection value, current limitation is carried out. (see figure 41) 4. under-voltage lockout (uvlo) uvlo circuit prevents the switch from turning on unt il the in exceeds 2.55v(typ). if the in drops below 2.5v(typ) while the switch turns on, then uvlo shuts off the power s witch. uvlo has hysteresis of a 50mv(typ). under-voltage lockout circuit works when the switch is on (en signal is active). (see figure 44,45) 5. fault flag (/oc) output fault flag output is an n-mos open drain output. at d etection of over-current or thermal shutdown, outpu t is low-level. over-current detection has delay filter. this delay filter prevents instantaneous current detection su ch as inrush current at switch on, hot plug from being informed to outsi de, but if charge up time for output capacitance is longer than delay time, fault flag output asserts low level. when out put current is close to current limit threshold val ue, fault flag output (/oc) might be low level before turning to over-cur rent condition because it is affected by current sw inging or noise. if fault flag output is unused, /oc pin should be conn ected to open or ground line. figure 51. over-current detection v en v out i out v /oc over-current detection thermal shutdown /oc delay time thermal shutdown recover figure 52. over-current detection, thermal shutdown timing (bd2222g, bd2242g) v out i out v /oc t /oc over - current detection limit current over - current load removed i th downloaded from: http:///
19/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 v en v out i out v /oc over-current detection thermal s hutdown /oc delay time thermal s hutdown recover figure 53. over-current detection, thermal shutdown timing (bd2243g) 6. adjustable current limit threshold bd2222/42/43g is able to change over-current detecti on value from 200ma to 1.7a by connecting resistanc e (r lim ) between ilim pin and gnd pin. the resistance value from 11.97k ? to 106.3k ? is recommended for r lim. the relational expression and the table for resistance value and over-current detection value are describe d below. allocate r lim close to ic as possible. be careful not to be affe cted by parasitic resistance of board pattern becau se over-current detection value is depended on the resistance value between ilim pin and gnd pin. ilim pin cannot be u sed as open and short to gnd pin. the r lim resistance tolerance directly affects the current limit threshold accuracy. recommended to use low tolerance resistance. over current threshold equation, ith(typ)[ma] = 19364 r lim [k ? ] -0.98 ith(min)[ma] = ith(typ)[ma] 0.98 - 96 ith(max)[ma] = ith(typ)[ma] 1.02 + 96 figure 54. ith vs. r lim graph 4 6 8 4 6 8 4 6 8 c r : r i [] c t : i [a] t. . a. downloaded from: http:///
20/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 r lim (k ? ) current limit threshold (ma) min typ max 106.30 100 200 300 70.28 198 300 402 52.40 296 400 504 41.73 394 500 606 34.65 492 600 708 29.60 590 700 810 25.83 688 800 912 22.91 786 900 1014 20.57 884 1000 1116 18.67 982 1100 1218 17.08 1080 1200 1320 15.74 1178 1300 1422 14.59 1276 1400 1524 13.60 1374 1500 1626 12.73 1472 1600 1728 11.97 1570 1700 1830 table 1. ith tolerance vs. r lim 7. output discharge function (bd2242g and bd2243g) when the switch is turned off from disable control input or uvlo function, the 60 ? (typ.) discharge circuit between out and gnd turns on. by turning on this switch, ele ctric charge at capacitive load is discharged. but w hen the voltage of in declines extremely, then the out pin becomes hi-z without uvlo function. power dissipation (ssop6 package) figure 55. power dissipation curve (pd-ta curve) * 70mm x 70mm x 1.6mm glass epoxy board 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 ambient temperature : ta [ ] power dissipation : pd [mw] 85 downloaded from: http:///
21/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 i/o equivalence circuit symbol pin no. equivalent circuit en 3 en /oc 4 /oc ilim 5 ilim out bd2222g 6 out out bd2242g bd2243g 6 out downloaded from: http:///
22/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse po larity when connecting the power supply, such as mounting an ex ternal diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedan ce supply lines. separate the ground and supply line s of the digital and analog blocks to prevent noise in the g round and supply lines of the digital block from af fecting the analog block. furthermore, connect a capacitor to ground a t all power supply pins. consider the effect of tem perature and aging on the capacitance value when using electroly tic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient co ndition. 4. ground wiring pattern when using both small-signal and large-current grou nd traces, the two ground traces should be routed s eparately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that th e ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedanc e. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may r esult in deterioration of the properties of the chip. the ab solute maximum rating of the pd stated in this speci fication is when the ic is mounted on a 70mm x 70mm x 1.6mm glass ep oxy board. in case of exceeding this absolute maxim um rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approxim ately obtained. the electrical characteristics are guaran teed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inr ush current may flow instantaneously due to the interna l powering sequence and delays, especially if the i c has more than one power supply. therefore, give spe cial consideration to power coupling capacitance, power wiring, width of ground wiring, and routing o f connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electr omagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connec ting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitor s completely after each process or step. the ic?s p ower supply should always be turned off completely before conne cting or removing it from the test setup during the inspection process. to prevent damage from static discharge, g round the ic during assembly and use similar precau tions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct w hen mounting the ic on the pcb. incorrect mounting ma y result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid e nvironment) and unintentional solder bridge deposited in betwee n pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely hi gh impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily cha rge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the tr ansistor and cause unexpected operation of the ic. so unless othe rwise specified, unused input terminals should be c onnected to the power supply or ground line. downloaded from: http:///
23/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p subs trate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersecti on of the p layers with the n layers of other eleme nts, creating a parasitic diode or transistor. for example (refer t o figure below): when gnd > pin a and gnd > pin b, the p-n junction ope rates as a parasitic diode. when gnd > pin b, the p-n junction operates as a para sitic transistor. parasitic diodes inevitably occur in the structure o f the ic. the operation of parasitic diodes can res ult in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p subs trate) should be avoided. figure 56. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the diele ctric constant considering the change of capacitanc e with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit tha t prevents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if how ever the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically re stored to normal operation. note that the tsd circuit operates in a situation th at exceeds the absolute maximum ratings and therefo re, under no circumstances, should the tsd circuit be used in a s et design or for any purpose other than protecting the ic from heat damage. downloaded from: http:///
24/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 ordering information b d 2 2 x x g - g t r part number bd2222 bd2242 bd2243 package g: ssop6 g: halogen free package packaging and forming specification tr: embossed tape and reel marking diagram part number part number marking bd2222g bn bd2242g ay bd2243g az part number marking ssop6 (top view) lot number 1 2 1pin mark downloaded from: http:///
25/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 physical dimension, tape and reel information package name ssop6 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantitydirection of feed th e direction i s t h e 1p in of p rod u ct i s a t t h e upper ri gh t wh en you hol d ree l on t h e l eft hand a nd you pull o u t t h e tape on t h e ri gh t hand 3000pcs tr ( ) 1pin downloaded from: http:///
26/26 a t a s h e e t bd2222g bd2242g bd2243g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300280-1-2 9.jun.2014 rev.004 revision history date revision changes 12.oct.2012 0000 draft 27.feb.2013 0001 over current threshold limits 7.mar.2013 001 authentic release 23.apr.2013 002 add typical wave forms for over current response change i/o equivalence circuit (en) 12.feb.2014 003 applied new style and improved understandability. improved symbol name. improved in operational notes. add output discharge function in functional descript ion 9.jun.2014 004 add bd2222g downloaded from: http:///
a ta she e t a t a s h e e t notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
a ta she e t a t a s h e e t notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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